As a Process Development Engineer, you will be responsible for providing technical support for Ultrasonic Wire Bonding technology processes of power electronics manufacturing, including further development of the existing ones, as well as the introduction of new processes. Develop methods and processes for the economical production of welded joints in power electronics for automotive and industrial semiconductors. Definition of individual unit process and process control concept Creating the risk-based work package plan (e.g., time, resource and material planning) for individual process development ensuring fast time to market. Individual process (implementation and evaluation), material & equipment development for achieving the requirements affected by own process, according to the Infineon development environment including 6-STEPS. Investigate multiple variables for process optimization, stabilization and quality improvements. Support the further development of ultrasonic wirebonding and laser supported bonding processes in industrial series production. Actively contribute to the achievement of KPI goals (i.e. Cpk, OEE,Yield, external and internal customer complaints) Prepare technical specifications of new non-standard (FOAK) equipment and machines in consultation with the internal applicant. Coordinate technical content with potential manufacturers according to technical specifications You have a great set of analytical skills that allow you to solve problems in an efficient way. Even when you are under pressure and facing complex situations, you remain focused on solutions, and as a team player, you share all the important information. A university degree in Mechanical Engineering, Materials Sciences, Physics or related fields 1-3 years of experience in process development in an industrial context (e.g. in electronics, metallurgical, or mechanical field) Professional experience in the field of assembly, connection and welding technology Creative in finding ways to improve existing processes and to develop processes for new products Experience in the automotive industry would be a plus Strong communication skills, with a methodic approach and a project management mindset Good command of English Backend The backend segments enable the development of comprehensive innovation across the entire value chain: starting with chip manufacturing, to wafer testing, preassembly, package development and development of new materials. The backend cluster combines the competencies for planning, productivity, innovation and quality, assembly and testing. We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
