Support Package Definition group to ensure package platform complexity, product requirement, customer commitment are met with respect to test-related issues. Responsible for samples, qualification build-up & transfer into manufacturing engineering. Responsible for project cost (NRE/Capital) planning, management and request for approval. Responsible for regular Project status reporting and milestone release to Project Owner / Stakeholders / Respective Release Board. Masters/Bachelor's Degree in Engineering and Physical Science or equivalent with at least 6 years of relevant working experience and there of at least 4 years of leading projects Experience in OSAT test and backend semiconductor packaging project management, cost-down / productivity, new process and package platform qualification / line transfer will be an added advantage Experience in semiconductor R&D in packaging group Has very good project management knowledge in terms of project initiation, planning and closing including reporting and documentation Analytical mind and high initiative to challenge him/herself and the team to move the next level of competency. Experience in analytical tool, e.g. Surface analysis, material characterisation, DoE, D/PFMEA, 8D and simulation knowledge will be an added advantage We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
