To sustain, improve the process in order to deliver products to customers at committed functionality, reliability, time, volume and cost. Ensure compliance of control plan deployment and quality controls are met; understanding of key parameters definition and controls. Knowledge in FOL process engineering specializing in Wire Bond. Bachelor's degree in Mechanical/ Electrical / Electronics /Microelectronics / Mechatronics / Materials Science / Semiconductor Technology. 5 years related experience in FOL Process Engineering or in Semiconductor Assembly Manufacturing background. Statistical data analysis, analytical and problem solving skills. Expert in prosses knowledge and skills in manufacturing process &some equipment knowledge. Systematic Problem Solving methodology e.g. 8D, DMAIC, Process Mapping, FTA, Fish Bond. Good knowledge and skills in production area; able to communicate with different level of staffs. We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
