Support Package Development Projects: Provide technical support and review package development projects to ensure alignment with automotive development goals. Ensure that processes meet automotive-specific requirements and standards. Provide training on key concepts related to packaging and automotive development for internal teams. Ensure all developments align with industry reliability standards and automotive requirements. University Degree in Electrical Engineering or a related field. Expertise in Assembly Processes: Extensive experience in semiconductor assembly processes with a strong understanding of wafer production and technology. Unit Process Development/Engineering Experience: Proven experience in unit process development and package definition, with experience in more than one area preferred. Strong Communication Skills: Exceptional ability to listen to internal customers, understand their needs, and communicate technical information effectively. Able to see the big picture and maintain a service-oriented mindset. Problem-Solving Capabilities: Strong analytical skills to support problem-solving efforts, generate hypotheses, analyze data, and derive actionable insights. Ability to apply lessons learned to improve future development processes. Familiarity with Methodologies: Knowledge of FMEA and 8D methodologies is essential for evaluating and improving product quality and process efficiency. We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
