Generate conceptual package outline and internal construction drawings, finalize and document the drawings and update the package drawings as needed. Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements. Coordinate the package cost estimations. Contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how. Support pre development & project definition stage, and continue to be package design expert throughout project phase. Actively scout for new packaging technologies and keep in touch with package development at competitors/subcons. Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics). At least 7 years of relevant working experience in IC/semiconductor environment/SMT. Knowledge in SMT, Semiconductor Packaging, Assembly and Test. Process and Equipment Engineering knowledge. Failure Analysis and Reliability Engineering. AutoCAD and 3D drafting preferred. We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
