Generate conceptual package outline and internal construction drawings, finalise and document the drawings and update the package drawings as needed. Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements Coordinate the package Cost Estimation (A1-A3) and Cost Indication(A3). Contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how. Support pre development & project definition stage, and continue to be package design expert throughout project phase. Consolidate the inputs for ADR and ensure the contents are updated (Aproject). Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) with 7 years of relevant working experience in IC/semiconductor environment. Good knowledge of semiconductor packaging, assembly and test. Process and Equipment Engineering knowledge. Failure Analysis and Reliability Engineering knowhow. Analytical and Problem Solving Skills. AutoCAD and 3D drafting preferred. We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
