Maintain a high-profile presence in the manufacturing area to provide sustaining manufacturing support. Resolves day to day production issues. Drives issues to root cause. Apply manufacturing best practices to drive reliability and predictability into our processes. Develop, lead and implement projects which improve operational efficiency and deliver savings which support corporate objectives, such as; on‐time delivery, productivity, scrap reduction, etc. Routinely works on complex issues where analysis of situations or data requires in‐depth evaluation of factors. Resolve various assembly and mechanical screening process issues through the use of structured problem solving techniques like 8D and related tools Lead teams and implement projects through continuous improvement initiatives, such as Lean or Six Sigma with hands‐on application - be an engaging floor practitioner. Identify and address project risks related to backend processes and materials, through the translation of DFMEA to PFMEA, and using other methods of risk management Take the initiative to look for and take advantage of opportunities and take independent actions and calculated risks. Help transition new products from R&D to Pilot and HVM following stage/gate process. Define the long-term process technology development roadmaps needed for new and next generation products Aside from working with internal manufacturing site, investigate and work with assembly and screening OSATs that will contribute to new product developments. Support supplier quality, purchasing and other groups to identify and work with material vendors impacting assembly and mechanical screening processes. Bachelor of Science (or equivalent) degree in engineering, such as mechanical, chemical, materials, manufacturing, electrical, or electronics engineering Minimum 5 years in backend semiconductor or electronic assembly process and/or package engineering; including hands-on experience package and process development for new products Strong knowledge in developing on-site and outsourced backend processes, such as die attach, wire bond, package sealing, lead finish, trim and form, and mechanical assemblies. Effective team leader and member, ability to collaborate with other teams and IR-Hi-Rel/Infineon sites for best practice, resource and knowledge sharing, and lead as expert mentoring technicians and new engineers Skilled in tools for new process development, process optimization, and continuous improvement such as DFM reviews, DOE, 8D, FMEA, Control Plans, OCAP, and statistical analysis methods/tools. Strong multi-tasking and prioritization skills. Effective in defining schedules and project completion. Self-starter, fast-learner with experience working in fast-pace and dynamic manufacturing environment Emphasizes personal and professional growth. Keeps technical and business knowledge and skills current Demonstrated strong verbal and written communication skills We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
