Support package platform assessments between subcons, as well as second source introduction Support Subcon/Technology roadmap alignment A Master degree in Mechanical/Electrical/Material Science/ Physics disciplines or related qualifications. PhD is a plus. Minimum 7 years of experience in semiconductor technology o manufacturing and assembly At least 5 years of experience in leading complex development projects and IPMA C certification or equivalent. A strong technical background and experience with advanced packaging technologies and assembly processes. Knowledge in PCB manufacturing, Chip Embedding, Power Module packaging and assembly including related manufacturing processes is a plus. Experience of working with or within semiconductor subcontractors. Good understanding of quality requirements of semiconductor products, as well as packages. The ability to work in and lead cross-functional and global teams in multicultural environment Strong communication skills in English and Chinese, German is a plus We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
