Develop and document Test plan for new IoT devices. Design and debug ATE Test Hardware and Software Production & Reliability. Implement Test programs, modify and release into offsite production. Good understanding of semiconductor device fundamentals (Analog/Digital and Circuit Theory) Sound understanding of Semiconductor Design for Test (DFT) techniques such as ATPG and PMU blocks like BUCLK and LDO's with Trimming procedure. Expertise in Semiconductor Testing Methodology, using Teradyne- Ultraflex-RF. Ultraflex + is added advantage. Good programming skills in writing and debugging test programs and ATE hardware related issues. Provide test engineering expertise and troubleshooting support to both internal and external customers. Competency in programming with Scripting languages (ie., Perl/Python) and high-level languages (ie., C/C++, JAVA, Visual Basic) Develop and debug characterization and production test programs for SOC Connectivity products contains Digital/Mixed signal/PMU/NVM/Radio blocks. Cross-functionally collaborate with project team members across development sites and product roles of IP design, applications, DFT, Product engineering, and Test engineering Good verbal and written communication skills are expected. Familiar with UNIX/LINUX environment, commands and shell scripts. We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process. Click here for more information about Diversity & Inclusion at Infineon.
