Perform full physical failure analysis on Memory, IoT, USB and Microcontroller, and write failure analysis report Liaise with relevant engineering groups on analysis and corrective actions Spearhead development of new analysis techniques to meet technology and device challenges Take ownership of certain tools and equipment Bachelor in Electronics/Electrical/Microelectronics/Material Engineering, Material Science, Physics or Chemistry Minimum 6-10 years' experience in silicon level failure analysis on IC failure Preferable with knowledge related to semiconductor and physics Familiarity in die deprocessing and proficiency in operating advance failure analysis tools e.g. FESEM and FIB would be added advantage Familiarity and proficiency in creating AI for failure analysis would be added advantage We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
